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Renesas Electronics America Inc R9A06G037GNP#AA0

R9A06G037GNP#AA0
Part No.:
R9A06G037GNP#AA0
Manufacturer:
Renesas Electronics America Inc
Category:
Embedded - System On Chip (SoC)
Package:
64-VFQFN Exposed Pad
Datasheet:
R9A06G037GNP#AA0.pdf
Description:
SOC PLC MODEM LSI SMART GRID ASS
Quantity:
RFQ

Product details

  • Package/Case:
    64-VFQFN Exposed Pad
  • Packaging:
    Tray
  • Series:
    -
  • ProductStatus:
    Active
  • Architecture:
    DSP, MCU
  • CoreProcessor:
    ARM® Cortex®-M3
  • FlashSize:
    -
  • RAMSize:
    128KB
  • Peripherals:
    PWM
  • Connectivity:
    CSI, I²C, UART
  • Speed:
    138MHz
  • PrimaryAttributes:
    -
  • OperatingTemperature:
    -40°C ~ 85°C (TA)
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    R9A06G037GNP#AA0.pdf

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